Copper-bonded steel rods with UL 467 certification and 250 microns molecular bonding.
Nickel bonding interface to prevent galvanic corrosion and ensure long-term reliability.
High lifespan exceeding 35 years.
Fully compliant with IEC 62305-2, UL standards, and IEEE Std-80 Ground Enhancement Material (GEM) ensures low soil resistivity, is environmentally safe, and IEC 62561-7 compliant.
Provides permanent, molecular bonds between conductors.
Superior conductivity and current-carrying capacity compared to mechanical joints.
Corrosion-resistant connections with no risk of loosening over time Maintenance-free and highly reliable for critical grounding and bonding applications.
Fully compliant with IEEE Std-837, IEEE Std-80, IEC 1025-1, BS 6651, BS 7430, and NFC 15-100